Dynex Power Inc., a leading, high power semiconductor company, revealed the formation of a new Semiconductor Foundry Services business. This will form part of the portfolio led by Mark Kempton, the company’s Business Unit Director for Semiconductor Devices.
As one of the industry leaders, Dynex has many years’ experience in the design and manufacture of IGBT die and Bipolar wafers, and currently runs a state-of-the-art wafer fabrication facility in Lincoln, England. Within the last few months, Dynex has been offering its foundry services to external semiconductor module companies, specifically focusing on IGBT die in the range of 1.2kV to 6.5kV.
Dynex offers to the market a broad range of established, proven, Trench Gate and DMOS die that form the basis of Dynex’s own high-quality IGBT modules. In addition, with its in-house chip design team, Dynex can customise die to specific customer requirements. This, coupled with full technical support, world-class design capability, and rapid response to customer needs, shows that Dynex is truly differentiated in the foundry services arena.
Mark Kempton, Business Unit Director – Semiconductor Devices, said, “The formation of the Dynex Foundry Services business is a logical expansion of the company’s commercial product and service offerings. The receipt of this first external order for high voltage IGBT die builds on decades of high-quality semiconductor fabrication experience at Dynex. The excellent chip performance, confirmed by the customer’s own testing, serves to highlight the quality of our design and manufacturing. We expect this business to grow into a substantial part of our operations over the coming years as we expand our customer base.”